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Technical Support
FAQ
What is different between Low Pressure Molding and Epoxy Potting?

PA Hot melt LPM

Epoxy molding

Case

Need

Meed case

Working temperature

-70~150℃

180℃

Housing

No need housing

Need housing

Cycle time

2-60 seconds

Chemical reaction needs 24 hours

density

0.98

Above 1.2

Curing

Much less curing time

Need curing

Working space

Occupy less space

Occupy large space

Energy consumption

Low

High

Resin consumption

Less

Much more

Process

Simple

Complex

Vacuum pumping

No need

Need 

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